Cadence Allegro系统互连平台能够跨集成电路、封装和PCB协同设计高性能互连。应用平台的协同设计方法，工程师可以迅速优化I/O缓冲器之间和跨集成电路、封装和PCB的系统互联。该方法能避免硬件返工并降低硬件成本和缩短设计周期。约束驱动的Allegro流程包括高级功能用于设计捕捉、信号完整性和物理实现。由于它还得到Cadence Encounter与Virtuoso平台的支持，Allegro协同设计方法使得高效的设计链协同成为现实。
Cadence OrCAD产品以其直观的操作界面以及强大的功能而深受广大电子工程师们的喜爱。作为世界上使用最广泛的EDA软件，早在上个世纪八十年代起，OrCAD就开始为上百万的电子工程师个体以及企业团队提供全套的设计工具，它通过所有工具之间的无缝集成，以其前所未有的生产力为个人和企业带来了巨大的经济效益。 而OrCAD最新版本17.0很好的沿袭了这些传统。
Cadence Design Systems, Inc. , the leader in global electronic design innovation, is pleased to announce the availability of Cadence Allegro and OrCAD 22.1-2022 P001 families of products aimed at boosting performance and productivity through improvements features and big fixed issues.
Cadence OrCAD and Allegro: What’s New in Release 22.1
The bellow presents sections describes the new features and enhancements in Allegro PCB Editor and Allegro Package Designer Plus, in release 22.1.
– Memory Usage and Performance Improvement Using 3DX Canvas
– High-Speed Structure Enhancements
. Parameterized High-Speed Structures
. Differential Pair Vias Replaced by Structures
. On-Canvas Structure Update and Variant Creation
– Converting Shapes, Vias, and Pins
– Dimensioning Update
– Route Keepouts Exception Use Model Enhancement
– Performance Enhancements
. Better Performance in Designs with Large Number of DRCs
. Faster Update to Smooth
. Better Move Performance
. Better Performance for Shape Parameter per Layer Override
. Restricting Command Window Messages
. Faster DRC Checking on Designs with Negative Layers
License Updates
A new license file is required to run release 22.1 products. Products from earlier releases such as 17.x, can also be opened with a release 22.1 license.
Structures and Vias in Mirrored Layers
If a database has structures in the mirrored layers state, that is marked as mirrored_layers, the database cannot be migrated to a version earlier than release 17.4 -2019, HotFix 028 (QIR4). The objects in the mirrored layers state are structures that are flipped using the Mirror Geometry command and then mirrored to the opposite side of the board. It is common to use the Mirror Geometry command to flip a structure on the same layer, but vias can also be flipped when moved or copied and if such vias are part of a symbol, module, or group, mirroring changes the vias to the Mirrored Layers state.
Cadence Allegro PCB Design helps bring your innovative and bleeding-edge designs to life. The constraint-driven environment provides real-time visual feedback and ensures the functionality and manufacturability of your PCBs while allowing you to keep designing.
OrCAD is a driving force in the PCB design industry. In order to help desingers keep up with the constant pace of change Cadence has been accelerating the pace of innovation delivering a stream of updates and product enhancements to users. OrCAD provides insight into industry-first capabilities made available to customers such as real-time design, DesignTrue DFM, constraint manager, in-design analysis, and more. In July of 1999, OrCAD and its product line were acquired by Cadence Design Systems. OrCAD integrated with Cadence Allegro PCB design software creating a fully scalable solution for solving any level of PCB design challenge.
Here we explore the various features of the Cadence PCB Suites and options.
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry.
Product: Cadence Allegro and OrCAD
Version: 22.1-2022 P001 (10/6/2022) Base release
Supported Architectures: x64
Website Home Page : http://www.cadence.com
Languages Supported: english
System Requirements: Windows *
Size: 9.8 Gb
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